Why are they using precision laser cutting means? 5 Advantages of Precision Laser Cutting

Laser cutting is a heat-based, non-contact manufacturing process that combines concentrated heat and thermal energy to apply pressure through a narrow path or kerf in order to melt and eject material. Laser cutting offers many advantages over conventional cutting processes: highly concentrated laser energy and CNC systems allow precise cutting of materials of varying thicknesses and complex shapes. Laser cutting allows for high accuracy and tight tolerances, reduces waste and allows for a variety of materials to be processed. Precision laser cutting processes are used in a variety of manufacturing applications and have become a valuable asset to the automotive industry, where complex thick parts are made from materials such as hydroforming, 3D shapes and airbags. The precision electronics industry uses it to improve metal or plastic components, housings, and printed circuits. From machine shops to small workshops to large industrial plants, they offer many benefits to manufacturers. Here are five advantages of using precision laser cutting.

1. Outstanding Accuracy Laser cut materials offer precision and edge quality that is superior to conventional materials. Laser cutting uses a highly focused beam of light that acts as a heat-affected zone during the cutting process and does not cause excessive thermal damage to adjacent surfaces. Additionally, the cutting process using high pressure gas, usually carbon dioxide, injects molten material to remove material inserts from the tightest parts, resulting in cleaner cuts and smoother edges for complex shapes and designs. Laser Cutting Machines are CNC (CNC) enabled, where the laser cutting process can be automatically controlled by a machine-ready program. CNC laser cutting machines reduce the risk of operator error and produce more accurate parts with tighter tolerances. 2.

2. Improve workplace safety Workplace injuries involving employees and equipment can negatively impact a company&qu39;s productivity and operating costs. Lifting and handling, including cutting, are areas prone to accidents. Laser cutting for these applications reduces the risk of accidents. The non-contact process means that the machine does not physically touch the material. In addition, the laser cutting process generates the beam without operator intervention, ensuring that the powerful beam is safely stored within the sealed machine. Typically, laser cutting requires no human intervention beyond inspection and maintenance, and the process minimizes direct contact with the surface of the workpiece compared to traditional cutting methods, reducing the risk of accidents and personal injury. Staff.

3. Wider variety of materials In addition to cutting complex geometries with greater precision, laser cutting allows fabricators to cut without mechanical modifications, allowing for a wider range of materials and a wider range of thicknesses. Using the same beam with different outputs, intensities and durations, laser cutting can cut a wide range of metals, similar machine setups can accurately cut materials of varying thicknesses, and integrated CNC components can be automated to provide more intuitive operation.

4. Faster Lead Times The time required to set up and manage a manufacturing facility increases the total cost of manufacturing per unit of output. The use of products and laser cutting processes reduces overall lead times and overall manufacturing costs. The use of laser cutting eliminates the need for stamping and crimping of materials or between materials of different thicknesses. Laser cutting setup time is significantly reduced compared to traditional cutting methods that require more machine programming than loading material.

In addition, the same cuts can be made up to 30 times faster with a laser than with conventional sawing.

5. Low Material Costs By using the laser cutting process, manufacturers can minimize material waste. Focusing on the beam used in the laser cutting process produces a tighter cut, which reduces the size of hot spots and the amount of damaged and unusable material. When working with soft materials, the deformation caused by the machine tool can also increase the amount of unnecessary material. The non-contact nature of laser cutting eliminates this problem, and the laser cutting process allows cutting with greater precision, tighter tolerances, and less material damage to the heat affected area. Allowing parts to be designed closer to the material, and tighter designs reduce material waste and lower material costs over time. The semiconductor industry uses laser cutting in the electronics industry to add cut silicon, gemstones and complex parts to make composite materials, while laser cutting has a wide range of applications in the medical industry, including medical devices and equipment. Medical manufacturing, precision tubing cutting and surgical procedures that require sterile and precise cuts. The resulting smaller heat zone reduces material waste, which lowers overall costs, and the non-contact nature reduces the risk of workplace injuries and accidents. The laser cutting process has shorter programming and format conversion times, providing greater production flexibility and minimizing lead times. Multidimensional tuning of the wavelength, amplitude, phase and polarization state of laser radiation is important for modern photonic technologies such as free-space optical communications, optical imaging and optical tweezers. However, due to the complex relationship between intra-microcavity resonance and extra-microcavity transmission, there is still a great problem to obtain a multi-degree-of-freedom laser with stable performance and high fatigue resistance. In order to modulate the output state of the lasers, the existing technology mainly realizes the modulation of the laser degrees of freedom by designing suitable super-surface structures, but the lack of tunable super-surface materials still restricts the development of multi-dimensional tunable lasers. Currently, the described chiral photosensitive tunable liquid crystal materials are mainly azobenzene materials, but the poor stability and fatigue resistance of such materials lead to the formation of many microholes in the liquid crystals when modulating these defects. This is usually manifested by larger laser tip widths, stray peaks and tip distortion. This is precisely because conventional chiral photosensitive materials limit the additional control degrees of freedom of wavelength-tunable lasers, which still makes multidimensional tunable lasers a difficult problem. Recently, Prof. Weihong Zhu from the School of Chemical and Molecular Engineering, East China University of Science and Technology and the Frontier Research Center of the Ministry of Education, and Prof. Zhigang Zheng from the School of Physics have taken a step forward in the field of molecular biology. Four-dimensional laser fluid. A crystal structure with photoregulation. In this work, a reversible endogenous chiral molecular photointerrupter was developed and a laser system with stable output on liquid crystals was constructed. In addition, the modification of the side ends of the endogenous chiral molecule using pentylbenzene as a liquid crystal-like moiety can further improve its compatibility with the liquid crystal, thereby enhancing the stability and fatigue resistance of the whole crystal system. Liquid. Reversible endogenous chiral molecular photoswitching can suppress the multi-domain structure induced by the molecule itself, solve the liquid crystal misalignment and spectral aberration caused by microcavity defects, and improve the optical performance of lasers. By complexly regulating the coupling balance between photonic intra-microcavity resonance and extra-microcavity transmission, a 4D tunable laser coding technique has been developed, which provides a new miniaturization and low cost for integrating optical chip networks, optical neural networks and optical networks. Balancing the link between intracavity photon resonance and extracavity transport is a scientific challenge in multidimensional laser design due to the uncontrollable nature of optically controlled chiral microcavity structures. On this basis, a class of photoconducting endogenous chiral chiral molecules with excellent thermal stability and fatigue resistance has been developed to realize multi-stable, dynamically modifiable 4D tunable lasers, which solves the problem of conventional tunable laser microcavities. The communication equilibrium problem is solved by implementing a tunable 4D laser coding scheme (wavelength, wavefront, spin angular momentum and orbital angular momentum). Manufacturing equipment often faces metal corrosion and rust problems in daily operations, which seriously affects the lifespan of metals and metal products and the safety of workers. Metal fabricated parts are prone to rust during manufacturing, processing and transportation. The so-called rust is a mixture of oxides and hydroxides formed on the metal surface under the action of oxygen and water. During operation and storage, it is difficult to avoid contact between the machine and oxygen, moisture or other corrosive media present in the air, resulting in galvanic corrosion and rust on the metal surface. , such as red rust on iron, green rust on copper and rust on aluminum form white rust. The problem of elevated crystal temperature is gradually becoming a major factor hindering the normal operation of semiconductor lasers. The exploration of new methods of heat dissipation continues. The manufacturing industry is fully cooperating. Although the development of materials with good thermal conductivity and good assembly techniques can solve the heat dissipation problem of high-power semiconductor lasers to a certain extent, the heat dissipation problem of high-power semiconductor lasers always needs to focus on convection heat dissipation and rationalization. Decision. Convection heat dissipation. Path is the key to solving the actual problem. The new heat dissipation process provides a precise foundation for the real heat dissipation work.